Embedded Technology Journal

Industry News

July 27, 2010

3D Design Software Speeds Response Time For RF Connector Specialist

Vishay Siliconix Releases Industry's Smallest and Thinnest N-Channel Chipscale Power MOSFET With 0.64-mm Sq. Area

Wolfson’s world-leading audio devices selected for LG mobile phones

QuickLogic Announces Innovative Framebuffer Solution to Extend Battery Life of Consumer Devices

Actel Announces New FlashPro4 Programmer

Get Smart With Design Workshops Highlighting SmartFusion FPGAs

July 26, 2010

Acrosser launches Small form factor 3.5” SBC solution with Intel Atom processor N450 and Core Technology in Versatile Vertical Applications

Ramtron Begins Commercial Sampling of MaxArias Wireless Memory

Industrial 1GB DDR2 VLP Registered Mini-DIMM

Conexant’s Embedded Audio Solution Chosen by VXi Corporation for USB Headset Adapter

MIPS Technologies Delivers Reference Implementation for Skype on MIPS-Based™ Devices

July 23, 2010

Mentor Embedded Nucleus Real Time Operating System Adoption Exceeds 2.1 Billion Handsets

Excelsys Xgen Power Supplies Now Conformal Coated for COTS/MIL Applications

July 22, 2010

VIA brings greater expediency and versatility to fanless embedded PC design with modular expansion board and chassis development kits

JAXA Selects eSOL’s ‘eCROS’ Software Platform for Venus Climate Orbiter and World’s First ‘Space Yacht’

EN55022 Class B Noise Compliant 3A DC/DC µModule Regulator Operates from 3.6V to 36V Input

New Rugged SBC from MEN Micro Offers Robust Display Functions for Mobile Applications

ADLINK Technology Debuts 6U CompactPCI® Processor Blade with Intel® Core™ i7 and QM57 Chipset

4.5V to 26.5V Input 6A DC/DC µModule Regulator with Tracking & Phase-Lockable Frequency Synchronization in 135mm2 Footprint

July 21, 2010

TEWS TECHNOLOGIES Introduces Extended Temperature and High-Density Full/Half Duplex Serial Communication cPCI Module

Wolfson’s next generation power management solution improves product performance and efficiency while reducing manufacturing costs

Fujitsu Selects Cypress’s Flexible TrueTouch™ Touchscreen Solution To Enable Separable Display for New docomo PRIME series F-04B Mobile Phone

IMVP-6/6+/6.5 Single-Phase DC/DC Controller

July 20, 2010

Drigmorn4 Low Power, High Performance, FPGA Embedded Processing Platform

ARX and Avnet Abacus deliver innovative thermal management solutions

TAOS, Inc. and QuickLogic Collaborate To Deliver TV-Quality Viewing and Long Battery Life to Mobile Devices

RF Expert SkyCross Calls for “Time Out” and Teaching Moment On Mobile Device Antenna Issues

Conexant Unveils Reference Design for Bluetooth®-Enabled ‘Connected Frames’ for Mobile Phones

Meggitt Sensing Systems Announces Expanded Product Line Offerings at San Juan Capistrano Facility

Eurotech Wins 4.2M USD in Contracts to Supply Embedded Computers for Augmentative Communication Devices